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Off-line Part Profiling

Bytewise's very first product was its Off-Line Profilometer which was designed to measure the exterior profile geometry of tire tread and sidewall extrusion samples.  To date, Bytewise has successfully installed over 150 of these systems around the world and it continues to be one of our most popular products.  The Profilometer is used in extrusion die shops to assist die designers and cutters in creating a die that produces a more specification-compliant extrusion.  The Profilometer has also been employed next to the extrusion line to measure periodic product samples to insure that the product remains within specification throughout a production cycle. 

In 2006, Bytewise introduced the Profilometer-SL that uses Bytewise Sheet-of-Light ("SL") sensors to, like its cousin, the Off-Line Profilometer, capture the profile of extruded components in an off-line environment.  The difference in these two products is primarily in the type of laser sensors employed.  The Profilometer-SL is slightly smaller, somewhat less expensive and is designed to be more portable than the Off-Line Profilometer.  Please contact us to determine which of these systems might be most appropriate for your situation.

Bytewise also offers a Bead-to-Bead ("B2B") measurement system that captures the complete cross-sectional profile of an inflated tire in a static measurement cycle.   The B2B system serves as an excellent diagnostic tool in tire testing labs for a variety of profile geometry applications.

Bytewise has worked with a global manufacturer of jet engine compressor blades and vanes, and land-based turbine blades to produce and deploy a high-speed airfoil measurement system suitable for the production environment. The Bytewise Blade360 offers a non-contact, high-speed measurement solution for airfoil section and platform measurements. Blade360 is a factory floor solution with limited axis of motion. It features an easy accessible, positively pressurized and temperature controlled measurement chamber.

Learn more about the following off-line part profiling applications: